IXD_609SI Datasheet, PDF (11/11 Pages) IXYS Corporation – AEC Q100 Qualified

INTEGRATED CIRCUITS DIVISION
5.4 Mechanical Dimensions
5.4.1 SI Package (8-Pin Power SOIC with Exposed Metal Back)
IXD_609SI
3.80
(0.150)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40 2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
7º
1.27
(0.050)
0.60
(0.024)
Recommended PCB Land Pattern
2.540 ± 0.254
(0.100 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
5.4.2 Tape & Reel Information for SI Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
B₀=5.30
(0.209)
W=12.00
(0.472)
Embossed Carrier
K = 2.10
0
(0.083)
A₀=6.50
(0.256)
P=8.00
(0.315)
User Direction of Feed
Dimensions
mm
(inches)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_609SI-R01
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/5/2013
R01
www.ixysic.com
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