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DE375-501N21A_09 Datasheet, PDF (1/5 Pages) IXYS Corporation – RF Power MOSFET | |||
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DE375-501N21A
RF Power MOSFET
⦠N-Channel Enhancement Mode
⦠Low Qg and Rg
⦠High dv/dt
⦠Nanosecond Switching
⦠50MHz Maximum Frequency
Symbol
VDSS
Test Conditions
TJ = 25°C to 150°C
Maximum Ratings
500
V
VDSS = 500 V
ID25
= 25 A
RDS(on) = 0.35 â¦
PDC
= 940 W
VDGR
TJ = 25°C to 150°C; RGS = 1 Mâ¦
500
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
Tc = 25°C
25
A
IDM
Tc = 25°C, pulse width limited by TJM
150
A
IAR
Tc = 25°C
21
A
EAR
Tc = 25°C
30 mJ
dv/dt
PDC
PDHS
IS ⤠IDM, di/dt ⤠ï°100A/µs, VDD ⤠VDSS,
Tj ⤠150°C, RG = 0.2â¦
IS = 0
Tc = 25°C
Derate 3.7W/°C above 25°C
5 V/ns
>200 V/ns
940 W
425
GATE
W
DRAIN
PDAMB
Tc = 25°C
4.5 W
RthJC
0.16 C/W
SG1 SG2
SD1 SD2
RthJHS
0.36 C/W
Features
Symbol Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified
VDSS
VGS(th)
IGSS
IDSS
VGS = 0 V, ID = 3 ma
VDS = VGS, ID = 250 µa
VGS = ±20 VDC, VDS = 0
VDS = 0.8 VDSS TJ = 25°C
VGS = 0
TJ = 125°C
min.
500
3.5
RDS(on)
VGS = 15 V, ID = 0.5ID25
Pulse test, t ⤠300µS, duty cycle d ⤠2%
typ.
4.6
max.
V
5.5 V
±100 nA
50 µA
1 mA
0.35 â¦
gfs
VDS = 100 V, ID = 0.5ID25, pulse test
6.5
7.6
9.0 S
TJ
-55
+175 °C
TJM
175
°C
Tstg
-55
+175 °C
⢠Isolated Substrate
â high isolation voltage (>2500V)
â excellent thermal transfer
â Increased temperature and power
cycling capability
⢠IXYS advanced low Qg process
⢠Low gate charge and capacitances
â easier to drive
â faster switching
⢠Low RDS(on)
⢠Very low insertion inductance (<2nH)
⢠No beryllium oxide (BeO) or other haz-
ardous materials
Advantages
⢠Optimized for RF and high speed
switching at frequencies to 50MHz
⢠Easy to mountâno insulators needed
⢠High power density
TL
1.6mm (0.063 in) from case for 10 s
300
°C
Weight
3
g
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