|
DE375-102N10A_09 Datasheet, PDF (1/5 Pages) IXYS Corporation – RF Power MOSFET | |||
|
DE375-102N10A
RF Power MOSFET
N-Channel Enhancement Mode
Low Qg and Rg
High dv/dt
Nanosecond Switching
Ideal for Class C, D, & E Applications
Symbol
VDSS
VDGR
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 Mâ¦
Maximum Ratings
1000
V
1000
V
VDSS = 1000 V
ID25
= 10 A
RDS(on) ⤠1.2 â¦
PDC
= 940 W
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
Tc = 25°C
10
A
IDM
Tc = 25°C, pulse width limited by TJM
60
A
IAR
Tc = 25°C
10
A
EAR
Tc = 25°C
30 mJ
dv/dt
IS ⤠IDM, di/dt ⤠ï°100A/µs, VDD ⤠VDSS,
Tj ⤠150°C, RG = 0.2â¦
IS = 0
5 V/ns
>200 V/ns
PDC
PDHS
Tc = 25°C
Derate 4.4W/°C above 25°C
940 W
425
W GATE
DRAIN
PDAMB
Tc = 25°C
4.5 W
RthJC
RthJHS
Symbol
VDSS
VGS(th)
IGSS
IDSS
RDS(on)
0.16 C/W
0.23 C/W
Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified
min. typ. max.
VGS = 0 V, ID = 3 ma
1000
V
VDS = VGS, ID = 250µA
2.5 3.1
5.5 V
VGS = ±20 VDC, VDS = 0
±100 nA
VDS = 0.8 VDSS TJ = 25°C
VGS = 0
TJ = 125°C
50 µA
1 mA
VGS = 15 V, ID = 0.5ID25
Pulse test, t ⤠300µS, duty cycle d ⤠2%
1.2 â¦
SG1 SG2
SD1 SD2
Features
⢠Isolated Substrate
â high isolation voltage (>2500V)
â excellent thermal transfer
â Increased temperature and power
cycling capability
⢠IXYS advanced low Qg process
⢠Low gate charge and capacitances
â easier to drive
â faster switching
⢠Low RDS(on)
⢠Very low insertion inductance (<2nH)
⢠No beryllium oxide (BeO) or other
hazardous materials
gfs
VDS = 20 V, ID = 0.5ID25, pulse test
TJ
TJM
Tstg
4
6
S Advantages
-55
+150 °C
⢠Optimized for RF and high speed
switching at frequencies to 50MHz
150
°C ⢠Easy to mountâno insulators needed
-55
+150 °C ⢠High power density
TL
1.6mm (0.063 in) from case for 10 s
300
°C
Weight
3
g
|
▷ |