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DE150-101N09A Datasheet, PDF (1/5 Pages) List of Unclassifed Manufacturers – RF Power MOSFET
DE150-101N09A
RF Power MOSFET
N-Channel Enhancement Mode
Low Qg and Rg
High dv/dt
Nanosecond Switching
Ideal for Class C, D, & E Applications
Symbol
VDSS
VDGR
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
Maximum Ratings
100
V
100
V
VDSS = 100 V
ID25
= 9.0 A
RDS(on) ≤ 0.16 Ω
PDC
= 200 W
VGS
VGSM
Continuous
Transient
±20
V
±30
V
ID25
Tc = 25°C
IDM
Tc = 25°C, pulse width limited by TJM
9.0
A
54
A
IAR
Tc = 25°C
14
A
EAR
Tc = 25°C
7.5 mJ
dv/dt
PDC
PDHS
IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS,
Tj ≤ 150°C, RG = 0.2Ω
IS = 0
Tc = 25°C
Derate 4.4W/°C above 25°C
5.5 V/ns
>200 V/ns
200
W GATE
80 W
DRAIN
PDAMB
RthJC
RthJHS
Tc = 25°C
3.5 W
0.74 C/W
1.50 C/W
Symbol Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified
min. typ. max.
VDSS
VGS(th)
IGSS
IDSS
VGS = 0 V, ID = 3 ma
VDS = VGS, ID = 4 ma
VGS = ±20 VDC, VDS = 0
VDS = 0.8 VDSS TJ = 25°C
VGS = 0
TJ = 125°C
100
V
2
2.8
V
±100 nA
25 µA
250 µA
RDS(on)
VGS = 15 V, ID = 0.5ID25
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
0.16
Ω
gfs
VDS = 15 V, ID = 0.5ID25, pulse test
2.5
3.0
S
TJ
-55
+175 °C
TJM
175
°C
Tstg
-55
+175 °C
SG1 SG2
SD1 SD2
Features
• Isolated Substrate
− high isolation voltage (>2500V)
− excellent thermal transfer
− Increased temperature and power
cycling capability
• IXYS advanced low Qg process
• Low gate charge and capacitances
− easier to drive
− faster switching
• Low RDS(on)
• Very low insertion inductance (<2nH)
• No beryllium oxide (BeO) or other
hazardous materials
Advantages
• Optimized for RF and high speed
switching at frequencies to >100MHz
• Easy to mount—no insulators needed
• High power density
TL
1.6mm(0.063 in) from case for 10 s
300
°C
Weight
2
g