CPC40055ST Datasheet, PDF (1/8 Pages) IXYS Corporation – AC Power Switch

INTEGRATED CIRCUITS DIVISION
CPC40055ST
AC Power Switch
Characteristics
Parameter
AC Operating Voltage
Load Current
With 5°C/W Heat Sink
No Heat Sink
On-State Voltage Drop
Blocking Voltage
Thermal Resistance,
Junction-to-Case, _JC
Rating
20-280
20
5
1.1
800
0.35
Units
V_AC (V_rms)
A_rms
V_P (at I_L=2A_P)
V_P
°C/W
Features
• Load Current up to 20A_rms with 5°C/W Heat Sink
• 800V_P Blocking Voltage
Creepage Pin 1 to Pin 2 of 0.225 inch (5.715 mm)
• 5mA Control Current
• Zero-Cross Switching
• 2500V_rms Isolation, Input to Output
Creepage Pin 2 to Pin 3 of 0.375 inch (9.525 mm)
• DC Control, AC Output
• Optically Isolated
• TTL and CMOS Compatible
• Low EMI and RFI Generation
• High Noise Immunity
• Machine Insertable, Wave Solderable
Applications
• Lighting
• Tungsten Load: 4.75A (Free Air), 15A (Heat Sink)
• Electrical Ballast: 5A (Free Air), 15A (Heat Sink)
• Programmable Control
• Process Control
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors: 1/3HP (Free Air), 1/2HP (Heat Sink)
• Heaters
Approvals
• UL 508 Recognized Component: File E69938
See “UL Approved Ratings” on page 4.
Description
CPC40055ST is an AC Solid State Switch utilizing
dual power SCR outputs. This device includes
zero-cross turn-on circuitry and is specified with an
800V_P blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500V_rms of isolation. As a result, the
CPC40055ST is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of communications and control systems.
The unique SuperSIP package pioneered by IXYS
Integrated Circuits Division allows Solid State Relays
to achieve the highest load current currently available
in any similar-sized package. This package features a
unique process in which the silicon chips are soft
soldered onto the ceramic Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V_rms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
CPC40055ST
Description
SuperSIP Package (13 per tube)
Pin Configuration & Waveforms
Control
ZC
1
2
AC Load
3
4
+ LED – LED
AC Line
Load
Current
Voltage
Across
Relay
DS-CPC40055ST-R03
www.ixysic.com
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