CPC1979 Datasheet, PDF (1/7 Pages) Clare, Inc. – ISOPLUS™-264 Power Relay

INTEGRATED CIRCUITS DIVISION
CPC1979
600V Single-Pole, Normally Open
Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, _JC
Rating
600
3.5
1.4
0.75
0.3
Units
V_P
A_rms / A_DC

°C/W
Features
• 3.5A_rms Load Current with 5°C/W Heat Sink
• Low 0.75 On-Resistance
• 600V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance: _JC = 0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1979 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.5A_rms continuous load current with a
5°C/W heat sink.
The CPC1979 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process in which the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V_rms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1979J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
e3
I_F
I_LOAD
90%
t_on
10%
t_off
DS-CPC1979-R09
www.ixysic.com
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