IS42S32800 Datasheet, PDF (62/62 Pages) Integrated Silicon Solution, Inc – Concurrent auto precharge

PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
N
1
D
ZD
e
N/2+1
E1 E
N/2
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
measured from the bottom of the
package.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
SEATING PLANE
A
b
A1
L
α
C
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min Max Min Max
Ref. Std.
No. Leads (N)
54
A — 1.20 — 0.047
A1
0.05 0.15 0.002 0.006
A2 — —
——
b
0.30 0.45 0.012 0.018
C
0.12 0.21 0.005 0.0083
D 22.02 22.42 0.867 0.8827
E1 10.03 10.29 0.395 0.405
E 11.56 11.96 0.455 0.471
e
0.80 BSC
0.031 BSC
L
0.40 0.60 0.016 0.024
L1 — —
——
ZD 0.71 REF
α
0° 8°
0° 8°
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min Max Min Max
Ref. Std.
No. Leads (N)
86
A
— 1.20 —
0.047
A1
0.05 0.15 0.002 0.006
A2
0.95 1.05 0.037 0.041
b
0.17 0.27 0.007 0.011
C
0.12 0.21 0.005 0.008
D 22.02 22.42 0.867 0.8827
E1 10.03 10.29 0.395 0.405
E 11.56 11.96 0.455 0.471
e
0.50 BSC
0.020 BSC
L
0.40 0.60 0.016 0.024
L1
0.80 REF
0.031 REF
ZD 0.61 REF
0.024 BSC
α
0° 8°
0° 8°
1