IS42S16100_08 Datasheet, PDF (3/81 Pages) Integrated Silicon Solution, Inc – 512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM

IS42S16100
PIN FUNCTIONS
Pin No. Symbol
Type
20 to 24
A0-A10
Input Pin
27 to 32
19
A11
Input Pin
16
CAS
Input Pin
34
CKE
Input Pin
35
CLK
Input Pin
18
CS
Input Pin
2, 3, 5, 6, 8, 9, 11
12, 39, 40, 42, 43,
45, 46, 48, 49
14, 36

DQ0 to
DQ Pin
DQ15
LDQM,
Input Pin
UDQM
17
15
7, 13, 38, 44
1, 25
4, 10, 41, 47
26, 50
RAS
Input Pin
WE
Input Pin
VDDQ
VDD
GNDQ
GND
Power Supply Pin
Power Supply Pin
Power Supply Pin
Power Supply Pin
Function (In Detail)
A0 to A10 are address inputs. A0-A10 are used as row address inputs during active
command input and A0-A7 as column address inputs during read or write command input.
A10 is also used to determine the precharge mode during other commands. If A10 is
LOW during precharge command, the bank selected by A11 is precharged, but if A10 is
HIGH, both banks will be precharged.
When A10 is HIGH in read or write command cycle, the precharge starts automatically
after the burst access.
These signals become part of the OP CODE during mode register set command input.
A11 is the bank selection signal. When A11 is LOW, bank 0 is selected and when high,
bank 1 is selected. This signal becomes part of the OP CODE during mode register set
command input.
CAS, in conjunction with the RAS and WE, forms the device command. See the
“Command Truth Table” item for details on device commands.
The CKE input determines whether the CLK input is enabled within the device. When is
CKE HIGH, the next rising edge of the CLK signal will be valid, and when LOW, invalid.
When CKE is LOW, the device will be in either the power-down mode, the clock suspend
mode, or the self refresh mode. The CKE is an asynchronous input.
CLK is the master clock input for this device. Except for CKE, all inputs to this device are
acquired in synchronization with the rising edge of this pin.
The CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The device
remains in the previous state when CS is HIGH.
DQ0 to DQ15 are DQ pins. DQ through these pins can be controlled in byte units
using the LDQM and UDQM pins.
LDQM and UDQM control the lower and upper bytes of the DQ buffers. In read
mode, LDQM and UDQM control the output buffer. When LDQM or UDQM is LOW, the
corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go to
the HIGH impedance state when LDQM/UDQM is HIGH. This function corresponds to OE
in conventional DRAMs. In write mode, LDQM and UDQM control the input buffer. When
LDQM or UDQM is LOW, the corresponding buffer byte is enabled, and data can be
written to the device. When LDQM or UDQM is HIGH, input data is masked and cannot
be written to the device.
RAS, in conjunction with CAS and WE, forms the device command. See the “Command
Truth Table” item for details on device commands.
WE, in conjunction with RAS and CAS, forms the device command. See the “Command
Truth Table” item for details on device commands.
VDDQ is the output buffer power supply.
VDD is the device internal power supply.
GNDQ is the output buffer ground.
GND is the device internal ground.
Integrated Silicon Solution, Inc. — www.issi.com
3
Rev.  D
01/28/08