IS24C32C Datasheet, PDF (17/20 Pages) Integrated Silicon Solution, Inc – 32K-bit 2-WIRE SERIAL CMOS EEPROM

IS24C32C
150-mil Plastic SOP
Package Code: G, GR
N
1
D
EH
SEATING PLANE
A
A1
L
e
B
α
C
Symbol
Ref. Std.
No. Leads
A
A1
B
C
D
E
H
e
L
150-mil Plastic SOP (G, GR)
Min Max
Min Max
Inches
mm
8
8
— 0.068
— 1.73
0.004 0.009
0.1 0.23
0.013 0.020
0.33 0.51
0.007 0.010
0.18 0.25
0.189 0.197
4.8
5
0.150 0.157
3.81 3.99
0.228 0.245
5.79 6.22
0.050 BSC
1.27 BSC
0.020 0.035
0.51 0.89
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be
measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004 inches at the
seating plane.
Integrated Silicon Solution, Inc.
17
Rev. B
1/04/08