IS43DR16320 Datasheet, PDF (1/29 Pages) Integrated Silicon Solution, Inc – Clock frequency up to 400MHz

IS43DR86400, IS43/46DR16320
512Mb (x8, x16) DDR2 SDRAM
FEATURES
• Clock frequency up to 400MHz
• Posted CAS
• Programmable CAS Latency: 3, 4, 5 and 6
• Programmable Additive Latency: 0, 1, 2, 3, 4 and 5
• Write Latency = Read Latency‐1
• Programmable Burst Sequence: Sequential or
Interleave
• Programmable Burst Length: 4 and 8
• Automatic and Controlled Precharge Command
• Power Down Mode
• Auto Refresh and Self Refresh
• Refresh Interval: 7.8 μs (8192 cycles/64 ms)
• OCD (Off‐Chip Driver Impedance Adjustment)
• ODT (On‐Die Termination)
• Weak Strength Data‐Output Driver Option
• Bidirectional differential Data Strobe (Single‐
ended data‐strobe is an optional feature)
OPTIONS
• Configuration:
− 64Mx8 (16M x 8 x 4 banks)
− 32Mx16 (8M x 16 x 4 banks)
• Package:
− 60‐ball FBGA for x8
− 84‐ball FBGA for x16
Clock Cycle Timing
Speed Grade
CL‐tRCD‐tRP
tCK (CL=3)
tCK (CL=4)
tCK (CL=5)
‐5B
DDR2‐400B
3‐3‐3
5
5
5
‐37C
DDR2‐533C
4‐4‐4
5
3.75
3.75
tCK (CL=6)
5
3.75
Frequency (max)
200
266
Note: The ‐5B device specification is shown for reference only.
PRELIMINARY INFORMATION
NOVEMBER 2009
• On‐Chip DLL aligns DQ and DQs transitions with
CK transitions
• Differential clock inputs CK and CK#
• VDD and VDDQ = 1.8V ± 0.1V
• PASR (Partial Array Self Refresh)
• SSTL_18 interface
• tRAS lockout supported
• Read Data Strobe supported (x8 only)
• Internal four bank operations with single pulsed
RAS
• Operating temperature:
Commercial (T_A = 0°C to +70°C ; T_C = 0°C to 85°C)
Industrial (T_A = ‐40°C to +85°C; T_C = ‐40°C to 95°C)
Automotive, A1 (T_A = ‐40°C to +85°C; T_C = ‐40°C to
95°C)
ADDRESS TABLE
Parameter
Row Addressing
Column Addressing
Bank Addressing
Precharge Addressing
64Mx8
A0‐A13
A0‐A9
BA0‐BA1
A10
32Mx16
A0‐A12
A0‐A9
BA0‐BA1
A10
‐3D
DDR2‐667D
5‐5‐5
5
3.75
3
3
333
‐25E
DDR2‐800E
6‐6‐6
5
3.75
3
2.5
400
‐25D
DDR2‐800D
5‐5‐5
5
3.75
2.5
2.5
400
Units
tCK
ns
ns
ns
ns
MHz
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. 00A, 11/17/2009