SM-BGA-9054 Datasheet, PDF (4/5 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

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10
14
4
2
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8
6
1
9
11
12
7
ITEM NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
BGA pin A1
Socket base pin A1
Description
GHz Socket Base 10mm IC 3mm Thk
Socket Lid
Compression Plate for 8.9x9.2mm IC
Compression Screw M6x1
#0-80 X .313 LG, SOC HD CAP
SCREW, ALLOY STL, BLK OXIDE
#0-80 Shoulder Screw, 0.062" thread
length
Target PCB
Test chip BGA109 11x11 array 0.5mm
pitch 6mm sq DUT
Dowel Pin, 1/32" x 3/16", SS
Ball guide BGA109 11x11 array
0.5mm pitch 6mm sq DUT
IC Guide BGA109 6mm Sq. 1.2mm
thick
SM elastomer; BGA109 11x11 array
0.5mm pitch 6mm sq DUT
Backing Plate
Insulation Plate
17.725
12.725
Material
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
Stainless Steel (18-8)
Alloy Steel
Stainless Steel (303)
FR4
Material <not specified>
Chrome Stainless Steel
Kapton Polyimide/Cirlex
Torlon 4203
SM elastomer
7075-T6 Alumium Alloy
FR4 High temp
12.725
17.725
13
Description: SM-BGA 6mm sq. 0.5mm pitch 11x11 array; 109 pin BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
4X 1.1913 THRU ALL
0-80 UNF THRU ALL
Insulation plate - Backing plate stack-up
SM-BGA-9054 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 7.82
STATUS: Released
ENG: S. Faiz
FILE: SM-BGA-9054 Dwg
SHEET: 4 OF 5
DRAWN BY: M. Raske
DATE: 09/16/2014
4.59
REV. A
SCALE: 3.5:1