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SS-BGA650A-01 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly
Compatible BGA Spec
Y
X
D
DETAIL
e
E
3
Øb
Ø0.30 Z X Y
Ø0.10
0.20
TOP VIEW
DETAIL
A
A1
Z
4
SS-BGA650A-01 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
SIDE VIEW
5
0.35 Z
0.2 Z
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME
Y14.5M-1994.
Dimension b is measured at the maximum
3 solder ball diameter, parallel to datum plane Z.
Datum Z (seating plane) is defined by the
4 spherical crowns of the solder balls.
Parallelism measurement shall exclude any
5 effect of mark on top surface of package.
Status: Released
Drawing: M.A. Fedde
File: SS-BGA650A-01 Dwg.mcd
Scale: -
Rev: A
Date: 12/21/08
Modified:
BOTTOM VIEW
DIM
MIN
MAX
A
3.4
A1
0.4
0.6
b
0.7
D
31.00 BSC
E
31.00 BSC
e
1.0 BSC
Array 30x30
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