SMP-BGA-8005 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

A1 Ball Corner
E
Ironwood Package Code: BGA 424A
A1
e
b
A
D
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum C (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SMP-BGA-8005 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 27.12
STATUS: Released
ENG: M.A. Fedde
FILE: SMP-BGA-8005 Dwg
DIM Minimum Maximum
A
1.70
1.90
A1
1.47
1.57
b
0.25
0.35
D
12.00 BSC
E
12.00 BSC
e
0.50 BSC
ARRAY
23 x 23
PIN COUNT
424
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 08/19/2014
REV. A
SCALE: 5:1