SMP-BGA-8005 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

20.225
28.225
SMP-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +155C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
A
A
28.225
22.270
20.225
Ball Guide
2.500
6.000
DUT
IC Guide
B
20.650
20.725
SECTION A-A
Description: SMP-BGA424 12mm IC 23x23 0.5mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SMP-BGA-8005 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 27.12
DETAIL B
SCALE 16 : 1
Interposer Protective Layer
Interposer
PCB
STATUS: Released
ENG: M.A. Fedde
FILE: SMP-BGA-8005 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 08/19/2014
REV. A
SCALE: 2:1