SM-BGA-9049 Datasheet, PDF (3/7 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

Ironwood Package Code: BGA550B
A1 Ball
12
8.300
B
12
0.500
A
0.500
8.590
DIE TOP
168 TOP BGA
(23x23 array)
0.500
A1 Ball
0.400
0.800
0.800
BOTTOM VIEW
550 SOLDER BALLS
(27X27 array)
0.400
0.10 C
0.350±0.040
0.520±0.040
0.710±0.080
C
0.190±0.070
0.10 C
Description: POP BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9049 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 91.16
3 DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C.
2 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPEHERICAL
CROWNS OF THE SOLDER BALLS
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y145-1994
NOTE: UNLESS OTHERWISE SPECIFIED
STATUS: Released
ENG: S. Huang
FILE: SM-BGA-9049 Dwg
SHEET: 3 OF 7
DRAWN BY: M. Raske
DATE: 8/14/2014
REV. A
SCALE: 4:1