SM-BGA-9049 Datasheet, PDF (2/7 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

2.055±0.025
Non plated alignment hole
A1 orientation mark
36±0.125
Socket base size
27.500±0.050
15.400
5.200
12.900
5.200
Latch
2.500±0.050 (x4)
Non plated mounting hole
Keep out area
0.250 pad (x550)
16.250±0.025 (x2)
Hinge
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB pad height: same or higher
than solder mask
10±0.050
10.400
20±0.050 (x2)
28±0.125 Socket base size
Description: Recommended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9049 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 91.16
STATUS: Released
ENG: S. Huang
FILE: SM-BGA-9049 Dwg
1.555±0.025
Non plated alignment hole
12.250±0.025 (x2)
Insulation plate footprint
SM interposer footprint
Max Ht: 17.5 mm
Max Ht: 4.9 mm
Max Ht: 4.8 mm
SHEET: 2 OF 7
DRAWN BY: M. Raske
DATE: 8/14/2014
REV. A
SCALE: 3:1