SM-BGA-9043 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Direct mounts to target PCB with hardware

Compatible BGA IC
5.70±0.08
B
Pin A1 orientation
Ironwood package code: BGA178A
A
0.25
0.275±0.050
0.10 M C A B
0.05 M C
6.50±0.08
0.40
6.00
0.25
TOP VIEW
5.20
B
BOTTOM VIEW
FRONT VIEW
1. Dimensions are in millimeters.
C
SEATING PLANE
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Ball diameter is measured at the maximum solder ball diameter, parallel to datum plane C.
4. Datum C (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: IC package
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9043 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 6.53
STATUS: Released
ENG: S. Faiz
FILE: SM-BGA-9043 Dwg
0.01 C
0.08
0.555±0.020
C
DETAIL B
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 12/12/2013
0.74±0.03
0.185±0.025
REV. B
SCALE: 10:1