SM-BGA-9033 Datasheet, PDF (3/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

0.20
D
X
Y
5.72
19.20
0.80
A1
Z
E _{18.69 12.76}
19.20
Package code: BGA564D1
0.25 Z
b
0.15 ^M
0.08 ^M
XYZ
Z
L
0.20 Z
DETAIL L
SCALE 6 : 1
DIM Minimum Maximum
A
2.7
A1
0.30
0.50
b
0.40
0.6
D
21.00 BSC
E
21.00 BSC
e
0.8 BSC
ARRAY
25 X 25
PIN COUNT
519
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9033 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight:
STATUS: Released
ENG: V. Panavala
FILE: SM-BGA-9033 Dwg
SHEET: 3 OF 5
SCALE: 2.25:1
DATE: 10/27/2015
REV. A