SM-BGA-9033 Datasheet, PDF (2/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

Note: BGA pattern is not symmetrical
with respect to the mounting holes.
BGA array is shifted 0.375mm to the
right of center.
A1 Orientation
2.6375 Ref.
9.225±0.025*
0.850±0.025
non plated alignment holes
2.2625 Ref.
9.600±0.025
33.60
30.80
6.7825±0.0250
6.5
9.3225±0.0250
19.00
0.80 Typ.
3.2mm max.
component height
19.2000 (x4)
26.225±0.125 socket base
28.725±0.125 backing plate
49.225
1.75mm max. component
height Latch Area
0.43 (x519)
1.70±0.10 (x4)
non plated mounting holes
Description: Recommended PCB Layout
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than solder mask
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9033 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight:
STATUS: Released
ENG: V. Panavala
FILE: SM-BGA-9033 Dwg
SHEET: 2 OF 5
SCALE: 2.5:1
DATE: 10/27/2015
REV. A