SM-BGA-9022 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

Compatible BGA device
Y
D
X
E
A
0.15 Z
b
0.10 Z
0.25 Z A B
1 typ.
4
4
24
A1
25
Ironwood Pacakage Code: BGA388B
DIM
MIN
A
1.00
A1
0.40
b
0.50
D
26.80
E
26.80
e
1.00
MAX
3.00
0.60
0.70
27.20
27.20
1. Dimensions are in millimeters.
26x26 Array
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible BGA Device
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9022 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 154.62
STATUS: Released
ENG: V. Panavala
FILE: SM-BGA-9022 Dwg
SHEET: 3 OF 4
DRAWN BY: V. Panavala
DATE: 2/6/2013
REV. B
SCALE: 1:1