SM-BGA-9012 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Direct mounts to target PCB with hardware

Compatible BGA IC
pin 1 marking
9.75
A
2X
0.15 C
TOP VIEW
IRONWOOD PACKAGE CODE : BGA74B1
B
6.00
A13
74 X 0.40
Solder Balls
0.15 C M A B
0.08 C M
0.75
H13
0.75
9.00
0.75
BOTTOM VIEW
Pin A1
5.25
0.375
H1
3.29
2.93
2.52
2.17
SIDE VIEW
B
C
0.43
0.28
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: IC package
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9012 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 10.96
STATUS: Released
ENG: E. Smolentseva
FILE: SM-BGA-9012 Dwg
DETAIL B
SCALE 10 : 1
SHEET: 3 OF 4
DRAWN BY: D. Hauer
DATE: 6/12/2012
C
84X
0.10 C
REV. B
SCALE: 5:1