SG-BGA-7057 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Compatible BGA Spec
X
D
Y
E
5
0.10 Z
A
Top View
Z₄
Front View
SG-BGA-7057 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
e
3 _Øb
Ø0.15 X Y
Ø0.08
Bottom View
0.08 Z
A1
1. Dimensions are in millimeters.
DIM
Interpret dimensions and tolerances per
2. _{ASME Y14.5M-1994.}
A
A1
Dimension b is measured at the
3 ^{maximum solder ball diameter, parallel}
b
to datum plane Z.
D
Datum Z (seating plane) is defined
4 _{by the spherical crowns of the solder balls. E}
Parallelism measurement shall exclude
e
5 any effect of mark on top surface of
package.
MIN
MAX
1.11
0.15
0.25
0.35
7.0 BSC
7.0 BSC
0.5 BSC
13 x 13 array
Status: Released
Drawing: H. Hansen
File: SG-BGA-7057 Dwg
All dimensions are in mm unless stated otherwise
Scale: 1:0.125 Rev: D
Date: 4/21/05
Modified: 04/30/14, DH
PAGE 3 of 4