SG-BGA-7057 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

A
Top View
Assembled
8.71mm +
IC thickness
6
Side View
(Section AA)
10
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
Recommended torque = 0.5 in. lbs.
8 in. oz.
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
1
4
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
3
9
7 Ball Guide: Kapton polyimide.
11
Customer's
5
BGA IC
2
8
12
7
Customer's Target PCB
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{IC Guide: Torlon}
SG-BGA-7057 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-7057 Dwg
Scale: -
Rev: D
Date: 4/21/05
Modified: 04/30/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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