SG-BGA-6225 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
D
Y
X
DETAIL
e
12.6mm MAX. (x4) _E
0.20
Top View
Side View
3 _Øb
Ø0.25 Z X Y
Ø0.10
Bottom View
DETAIL
A
A1
Z₄
5
0.20 Z
0.2 Z
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and tolerances per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum solder
3 _{ball diameter, parallel to datum plane Z.}
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5 ^{Parallelism measurement shall exclude any effect}
of mark on top surface of package.
DIM
MIN
MAX
A
1.7
A1
0.3
b
0.5
0.7
D
18.00±0.10 BSC
E
20.00±0.10 BSC
e
1.0 BSC
Array 17x19
SG-BGA-6225 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6225 Dwg
Scale: -
Rev: F
Date: 5/15/07
Modified: 7/8/09, AE
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