SG-BGA-6225 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
26.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
8
Assembled
TBD
9
26.225mm
12
13
Side View
(Section AA)
10
6
Customer's
7
BGA IC
A
2
4
1
3
5
11
Customer's Target PCB
Socket base: Black anodized Aluminum.
1 Thickness = 5mm.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
2 _thread.
Socket base screw: Socket head cap, alloy steel with
3 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
4 ^{IC Frame: Ultem 1000}
5 ^{Ball Guide: Kapton polyimide.}
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
Elastomer: 40 micron dia gold plated brass
7
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Socket Lid: Black anodized Aluminum.
8 Thickness = 2.5mm.
9 ^{IC Guide: Ultem 1000}
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Compression screw: Black anodized Aluminum.
12 Thickness = 5mm, Hex socket = 5mm.
Compression Plate: Black anodized Aluminum.
13 _{Thickness = 2.5mm.}
SG-BGA-6225 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6225 Dwg
Scale: -
Rev: F
Date: 5/15/07
Modified: 7/8/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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