SG-BGA-6193 Datasheet, PDF (3/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
E
Detail
e
A1 CORNER
0.20
A
A1
DETAIL
Z4
5
0.20 Z
0.2 Z
3 Øb
Ø0.25 Z X Y
Ø0.10 Z
1. ^{Dimensions are in millimeters.}
2. ^{Interpret dimensions and tolerances per ASME}
Y14.5M-1994.
3 ^{Dimension b is measured at the maximum}
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM
MIN
MAX
A
2.2
A1
0.5
0.7
b
0.90
D
35.0 ±0.2
E
35.0 ±0.2
e
1.27 BSC
Array 26x26
SG-BGA-6193 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6193 Dwg
Scale: -
Rev: A
Date: 10/01/07
Modified:
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