SG-BGA-6193 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
(without fan)
A
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
A
1
Side View
(Section AA)
3
Assembled
46mm + IC thickness
2
6
Apply 6 in-oz
torque per screw
9
11
8
7
1 Fan: 10mm thick, 50mm square, 12V, 0.29 m3/min
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
3 ^{Heat Sink Lid: Black anodized Aluminum.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Ultem 1000
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: ultem 1000.}
Socket base screw: Socket head cap, Alloy steel with
8 black oxide finish, M2 thread, 12mm long
Socket lid screw: Socket head cap, Alloy steel with
9 _{black oxide finsih, M2 thread, 10mm long}
10 ^{Backing Plate: Stainless steel.}
Thermal Pad: Bergquist Gap Pad
11 Thickness = 0.015".
5
SG-BGA-6193 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
BGA package
10
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6193 Dwg
Scale: -
Rev: A
Date: 10/01/07
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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