SG-BGA-6170 Datasheet, PDF (3/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
DETAIL
e
E
3 _Øb
Ø0.10 Z
Ø0.30 Z X Y
TOP VIEW
0.20
A
A1
DETAIL
Z₄
SIDE VIEW
BOTTOM VIEW
5
0.15 Z
0.15 Z
1. _{Dimensions are in millimeters.}
2. Interpret dimensions and tolerances
per ASME Y14.5M-1994.
Dimension b is measured at the
3 _{maximum solder ball diameter, parallel}
to datum plane Z.
Datum Z (seating plane) is defined by
4 _{the spherical crowns of the solder balls.}
Parallelism measurement shall exclude
5 any effect of mark on top surface of
package.
DIM MIN
MAX
A
2.36
A1
0.4
0.6
b
0.7
D
37.50 BSC
E
37.50 BSC
e
1.0 BSC
Array: 36x36
SG-BGA-6170 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6170 Dwg
Scale: -
Rev: A
Date: 12/5/05
Modified:
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