SG-BGA-6170 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
45mm
A
Side View
(Section AA)
20 watt heatsink
7
Max Height
23mm
6
BGA IC
4
SG-BGA-6170 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
1
2
10
5
Target PCB
Heatsink Lid: Black anodized 6061 Aluminum.
1 _{Thickness = 16mm.}
Socket base: Black anodized 6061 Aluminum.
2 _{Thickness = 5mm.}
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a
3 _{silicone rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
4 _{Thickness = 0.75mm.}
Ball Guide: Kapton polyimide.
5 _{Thickness = 0.25mm.}
Socket base screw: Socket head cap, Alloy
6 steel with black oxide finish, 0-80 fine thread ,
9.525mm long.
Socket lid screw: Socket head cap, Alloy steel
7 with black oxide finish, 0-80 fine thread ,
4.76mm long.
Backing Plate: Black anodized 6061 Aluminum.
8 _{Thickness = 6.35mm.}
9 Insulation Plate: FR4/G10, Thickness = 1.59mm.
8
3
Status: Released
Drawing: H. Hansen
File: SG-BGA-6170 Dwg
10 ^{IC Frame: FR4/G10}
9
Scale: 1:0.7
Rev: A
Date: 12/5/05
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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