SG-BGA-6140 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
Y
D
DETAI
L
e
E
0.20
A
A1
3 Øb
Ø0.15 Z
Ø0.30 Z X Y
TOP VIEW
SIDE VIEW
BOTTOM VIEW
DETAIL
5
0.20 Z
Z4
0.2 Z
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and toleraces per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plame Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM
MIN
MAX
A
2.21
A1
0.3
0.5
b
0.60
D
27.00 BSC
E
27.00 BSC
e
1.27 BSC
Array 20x20
SG-BGA-6140 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: B. ROUX
File: SG-BGA-6140 Dwg
Scale: -
Rev: B
Date: 12/16/04
Modified: 5/19/09
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