SG-BGA-6140 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
32.225mm
10
6
Customer's
BGA IC
SG-BGA-6140 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
11
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
A
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Recommended torque = 6.42 in lbs.
5
9
6
2
7
8
8
7
9
Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
Ball Guide: Kapton polyimide.
Socket base screw: Fillister head, Alloy steel with
black oxide finish, 0-80 fine thread , 0.625" long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 Insulation Plate: FR4/G10, 1.59mm thick.
Customer's Target PCB
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Status: Released
Drawing: B.ROUX
File: SG-BGA-6140 Dwg
Scale: -
Rev: B
Date: 12/16/04
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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