CG-BGA-5005 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Directly mounts to target PCB with hardware

Compatible BGA Spec.
X
D
Y
E
Detail
A
A1
DETAIL
Z4
5
0.10 Z
0.08 Z
0.10
Top View
e
3 _Øb
Ø0.05 Z X Y
Ø0.05 Z
Bottom View
CG-BGA-5005 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Side View
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and tolerances per}
ASME Y14.5M-1994.
Dimension b is measured at the
3 _{maximum solder ball diameter, parallel}
to datum plane Z.
4
Datum Z (seating plane) is defined
by the spherical crowns of the solder balls.
Parallelism measurement shall exclude
5 any effect of mark on top surface of
package.
DIM
MIN
MAX
A
1.25
A1
0.16
0.26
b
0.37
D
9.5 BSC
E
11.5 BSC
e
0.5 BSC
18 x 22 array
Status: Released
Drawing: Vinayak R
File: CG-BGA-5005 Dwg
Scale: -
Rev: A
Date: 8/31/09
Modified:
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