SM-BGA-9055 Datasheet, PDF (2/5 Pages) Ironwood Electronics. – Easily removalbe swivel socket lid

2.8625±0.025
Socket orientation
mark corner
1.9125
3.7125
3.4625
A1
3.0916
2.80
3.3625
H1
1.0773
*Note: BGA pattern is not symmetrical with respect
to the mounting holes. The pattern is shifted to the
left of center by 0.25mm.
1.0773
3.3625
1.710±0.0250 (x4)
1.9625
area available for
component placement on
the component side of
the PCB. Maximum
component height is
2mm.
A8
1.0773
3.3625
3.0916
0.2500 pad (x64)
1.15
3.1125±0.025
3.3625
1.65
2.1625
0.5125
4.00 (x5)
0.850±0.025 THRU (x2)
non plated alignment hole
12.225±0.125 socket base size
13.725±0.125 Backing plate
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9055 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 5.06
STATUS: Released
ENG: E. Smolentseva
FILE: SM-BGA-9055 Dwg
Target PCB Recommendations
Total thickness: 0.76mm min.
Plating: Gold or Solder finish
SHEET: 2 OF 5
DRAWN BY: M. Raske
DATE: 12/22/2014
REV. A
SCALE: 7:1