SG-BGA-6373 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.125mm(x4)
1.25mm±0.125mm(x4)
5.0375mm*
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
0.8mm typ.
Socket Body
Size
2.2625mm
11.2mm
5.08mm
2.54mm
Ø 0.85mm±0.05mm (x2)
Alignment Hole
Ø 0.4mm (x90) pad
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: backing plate may be required based on end user's application
SG-BGA-6373 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
6.4mm
10.95mm
15.725mm(x4)
18.225mm±0.125mm (x4)
Ø 1.71mm±0.1mm (x4)
Mounting Hole
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 4:1
Rev: B
Drawing: S. Huang
File: SG-BGA-6373 Dwg.mcd
Date: 12/20/2012
Modified: 04/16/14, DH
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