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SG-BGA-6373 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
18.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
12
18.225mm
4
3
Side View
(Section AA)
6
10
5
Customer's
BGA IC
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
3
Recommended torque = 1 in lbs. 4
5
9
6
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
2
8
7
11
Customer's Target PCB
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, Alloy steel with
8 black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Socket head cap, Alloy steel with
9 black oxide finish, 0-80 fine thread , 4.76mm long.
10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
Nylon washer: 1.73mm ID; 4.78mm OD
11 0.64mm thickness.
12 IC guide: Torlon
SG-BGA-6373 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Drawing: S. Huang
File: SG-BGA-6373 Dwg.mcd
Scale: -
Rev: B
Date: 12/20/2012
Modified: 04/16/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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