SG-BGA-6135 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
1.25mm±0.13mm(x4)
1.25mm±0.13mm(x4)
2.46mm
Orientation Mark
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.84mm*
0.8mm typ.
2.54mm
Socket
Body Size
Ø 0.85mm±0.025mm (x2)
Alignment Hole
Ø 0.43mm pad
5.08mm
21.725mm(x4)
Ø 1.61mm±0.05mm (x4)
Mounting Hole
24.225mm (x4)
26.725mm sq. backing plate
Target PCB Recommendations
Total thickness: 1.6mm min.
Note: Full BGA pattern shown. Please adjust pattern according to individual requirements.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6135 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6135 Dwg
Scale: 3:1
Rev: B
Date: 12/21/04
Modified: 1/10/07
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