SG-BGA-6135 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
24.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
Assembled
8.33mm +
IC thickness
24.225mm
1
6
10
Customer's
BGA IC
4
3
5
A
Recommended torque = 2 in lbs.
(484 BGA)
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 Ball Guide: Kapton film.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Socket head cap, alloy steel with
9
black oxide finish, 0-80 fine thread , 4.76mm long.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 Backing Plate: Anodized Aluminum 6.35mm thick.
SG-BGA-6135 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6135 Dwg
Scale: -
Rev: B
Date: 12/21/04
Modified: 1/10/07
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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