CG-BGA-4020 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Minimum real estate required

A1 location
on socket
0.85±0.05 (x2)
Non plated alignment hole
Orientation mark
on backing plate
4.50
32.600±0.125
socket lid size
23.495±0.125
Socket base size
6.50
*Note: BGA pattern is not symmetrical with respect
to the mounting holes.
1.71±0.01 (x4)
Non plated mounting hole
16.30
11.50
9.20
5.50
0.00
6.50
9.20
11.50
16.30
23.495±0.125
No component area
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
39.225±0.125
Socket lid size
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CG-BGA-4020 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish: N/A
Weight: 69.63
STATUS: Released
ENG: S. Huang
FILE: CG-BGA-4020 Dwg
Max Component Ht. 13.46mm
Max Component Ht. 1.86mm
Max Component Ht. 0.81mm
SHEET: 2 OF 4
DRAWN BY: M. Raske
DATE: 05/09/2014
REV. A
SCALE: 3:1