SG-BGA-6399 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Easily removable swivel socket lid

GHz BGA DIRECT MOUNT, SOLDERLESS SOCKET with a Heatsink.
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed reliable elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable swivel socket lid
Recommended torque: 22 in-lbs.
See user instructions on page 5 prior to tightinging compression
screw asembly.
52.00
52.00
39.90
50.24
7.94
38.73
38.73
Description: GHz BGA socket with a heatsink for 1369 pin, 0.8mm pitch, 37x37 array, 31mmx31mm BGA package.
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6399 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 126.83
STATUS: Released
ENG: S. Huang
FILE: SG-BGA-6399 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 1/15/2014
13.90
24.24
REV. A
SCALE: 1:1