CG-QFN-7009 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Minimum real estate required

M
28.225
21.00
CG-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
Features:
• Directly mounts to target PCB (needs tooling holes)
with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily operable snap socket spring lid
M
A1 location
11.775
13.210
2.525
4.305 1.725
SECTION M-M
4.613
20.00
4.613
Description: CG-QFN40A 6x6mm 0.5mm pitch Snap lid
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance
±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CG-QFN-7009 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 2.01
STATUS: Released
ENG: V. Panavala
FILE: CG-QFN-7009 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 01/02/2015
40.471
4.804
9.060
13.172
REV. A
SCALE: 2:1