CBT-BGA-6011 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

A1 Corner
CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
28.23
6.00 THRU
21.00
8.93
6.00
37.20
16.50
5.81
4.06
15.06
2.00
20.2250
1.20
1.89
4.62
6.33
SIDE VIEW
FRONT VIEW
20.225
Description: Clamshell stamped spring pin socket; CBT-BGA 10x12mm 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6011 Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 12.87
STATUS: Released
DRAWN BY: M. Raske
FILE: CBT-BGA-6011
SHEET: 1 OF 4
SCALE: 2:1
DATE: 09/05/2012
REV. A