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IRF9383MPBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Isolation Switch for Input Power or Battery Application | |||
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IRF9383MPbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
e Junction-to-Ambient
i Junction-to-Ambient
j Junction-to-Ambient
f k Junction-to-Case ,
Junction-to-PCB Mounted
e Linear Derating Factor
Max.
2.1
1.3
113
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.02
Max.
60
âââ
âââ
1.1
âââ
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
R 1R 1
R 2R 2
R 3R 3
R 4R 4
Ri (°C/W) Ïi (sec)
ÏJ ÏJ
Ï1 Ï1
ÏAÏA 2.7194 0.0138004
Ï2 Ï2
Ï3 Ï3
Ï4 Ï4
23.1599 55.766563
10.2579 0.6520047
Ci= Ïi/Ri
Ci= Ïi/Ri
23.6469 7.7259631
0.001
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006 1E-005 0.0001
0.001
0.01
0.1
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling, mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
 Mounted on minimum footprint full size
 Mounted to a PCB with small board with metalized back and with small
clip heatsink (still air)
clip heatsink (still air)
3 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback
June 2, 2015
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