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IRF8308MTRPBF Datasheet, PDF (3/9 Pages) International Rectifier – RoHs Compliant Containing No Lead and Bromide | |||
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IRF8308MPbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.022
Max.
45
âââ
âââ
1.4
âââ
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
ÏJ
ÏJ
Ï1
Ï1
R1
R1
R2
R2
Ï2 Ï2
Ci= Ïi/Ri
Ci i/Ri
R3 R4 Ri (°C/W) Ïι (sec)
R3
R4
Ïa 0.99292 0.000074
Ï3 Ï3
Ï4
Ï4
2.171681 0.007859
24.14602 0.959
17.69469 32.6
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling, mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
(still air).
www.irf.com
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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