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IRF6811STR1PBF Datasheet, PDF (3/9 Pages) International Rectifier – RoHS Compliant and Halogen Free | |||
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IRF6811SPbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
Max.
2.1
1.3
32
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.017
Max.
60
âââ
âââ
3.9
âââ
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
R 1R 1
R2R2
R 3R 3
R 4R 4
Ri (°C/W) Ïi (sec)
ÏJ ÏJ
Ï1 Ï1
ÏAÏA 21.298
2.002815
Ï2 Ï2
Ï3 Ï3
Ï4 Ï4
24.844 0.296144
3.3632 0.000886
Ci= Ïi/Ri
Ci= Ïi/Ri
10.411 0.027621
0.01
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling, mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
(still air).
www.irf.com
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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