IRF6717MTR1PBF Datasheet, PDF (3/9 Pages) International Rectifier – RoHs Compliant and Halgen Free

IRF6717MPbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
Max.
2.8
1.8
96
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.022
Max.
45
–––
–––
1.3
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
Ri (°C/W) τi (sec)
0.0116 0.000007
0.0289 3.55E-06
τJ
τJ
τ1
τ1
R1
R1
Ci= τi/Ri
Ci= τi/Ri
R2
R2
τ2
τ2
R3
R3
τ3
τ3
R4
R4
R5
R5
R6
R6
R7
R7
τ4
τ4
τ5
τ5
τ6
τ6
τ7
τ7
R8
R8
τA
τA
0.2249
0.3032
0.7515
2.7510
17.682
0.000076
0.006892
0.001645
0.009995
38.19138
0.01
SINGLE PULSE
( THERMAL RESPONSE )
Notes: ^{23.053 1.05185}
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006 1E-005 0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
ˆ Used double sided cooling, mounting pad with large heatsink.
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
www.irf.com
‰ Mounted to a PCB with
small clip heatsink (still air)
‰ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3