IRF6646 Datasheet, PDF (3/9 Pages) International Rectifier – DirectFET Power MOSFET

IRF6646
Absolute Maximum Ratings
Parameter
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
Max.
45
–––
–––
1.4
–––
Units
W
°C
Units
°C/W
100
D = 0.50
10
1
0.1
0.01
0.001
1E-006
0.20
0.10
0.05
0.02
0.01
τ_{J τJ}
τ_{1 τ1}
R_1R1
SINGLE PULSE
( THERMAL RESPONSE )
Ci= τi/Ri
Ci i/Ri
R_2R2
τ_{2 τ2}
R_3R3
R_4R4
τ_Cτ
Ri (°C/W)
0.678449
17.29903
τi (sec)
0.00086
0.57756
τ_{3 τ3}
τ_{4 τ4}
17.56647 8.94
9.470128 106
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Notes:
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Surface mounted on 1 in. square Cu board, steady state.
T_C measured with thermocouple incontact with top (Drain) of part.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
R_θ is measured at T_J of approximately 90°C.
back and with small clip heatsink.
Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3