IRF6644TR1PBF Datasheet, PDF (3/10 Pages) International Rectifier – Ideal for High Performance Isolated Converter Primary Switch Socket

IRF6644PbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
c Power Dissipation
c Power Dissipation
f Power Dissipation
Parameter
T_P
Peak Soldering Temperature
T_J
Operating Junction and
T_STG
Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
cg Junction-to-Ambient
R_θJA
dg Junction-to-Ambient
R_θJA
eg Junction-to-Ambient
R_θJC
fg Junction-to-Case
R_θJ-PCB
Junction-to-PCB Mounted
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
Max.
45
–––
–––
1.4
–––
Units
W
°C
Units
°C/W
100
10
1
0.1
0.01
0.001
D = 0.50
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
τ_{J τJ}
τ_{1 τ1}
R_1R1
Ci= τi/Ri
Ci i/Ri
R_2R2
τ_{2 τ2}
R_3R3
τ_{3 τ3}
0.0001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
R_4R4
τ_Cτ
Ri (°C/W)
0.6784
17.299
τi (sec)
0.00086
0.57756
τ_{4 τ4}
17.566 8.94
9.4701 106
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1
10
100
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
ƒ Surface mounted on 1 in. square Cu board, steady state.
‰ Mounted on minimum footprint full size board with metalized
„ T_C measured with thermocouple incontact with top (Drain) of part. ^{back and with small clip heatsink.}
ˆ Used double sided cooling, mounting pad with large heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
board (still air).
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‰ Mounted to a PCB with
small clip heatsink (still air)
‰ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3