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IRF6633PBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Low Conduction Losses and Switching Losses | |||
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IRF6633PbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
RθJA
el Junction-to-Ambient
RθJA
jl Junction-to-Ambient
RθJA
kl Junction-to-Ambient
RθJC
fl Junction-to-Case
RθJ-PCB
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.3
1.5
89
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.018
Max.
55
âââ
âââ
3.0
âââ
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
1
0.1
0.01
1E-006
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
R1R1
R2R2
R3R3
R4R4
R5R5
Ri (°C/W) Ïi (sec)
ÏJ ÏJ
ÏCÏ 0.6676 0.000066
Ï1 Ï1
Ï2 Ï2
Ï3 Ï3
Ï4 Ï4
Ï5 Ï5
1.0462 0.000896
Ci= Ïi/Ri
1.5611 0.004386
Ci= Ïi/Ri
29.282 0.68618
25.455 32
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling, mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
(still air).
www.irf.com
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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