IRF6611TR1 Datasheet, PDF (3/10 Pages) International Rectifier – RoHS compliant containing no lead or bromide

Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
h Power Dissipation
h Power Dissipation
k Power Dissipation
Parameter
T_P
Peak Soldering Temperature
T_J
Operating Junction and
T_STG
Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
R_θJA
R_θJA
R_θJC
hl Junction-to-Ambient
il Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Case
R_θJ-PCB
Junction-to-PCB Mounted
gà Linear Derating Factor
IRF6611
Max.
3.9
2.5
89
270
-40 to + 150
Units
W
°C
Typ.
–––
12.5
20
–––
1.0
0.031
Max.
32
–––
–––
1.4
–––
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
τ_{J τJ}
τ_{1 τ1}
R _1R1
Ci= τi/Ri
Ci τi/Ri
R _{2R 2}
τ_{2 τ2}
R_{3R3 Ri (°C/W)}
τ_{Aτ 1.8310}
τ_{3 τ3}
16.033
14.139
τi (sec)
0.000686
0.786140
28
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006 1E-005 0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
† Surface mounted on 1 in. square Cu board, steady state.
‡ Used double sided cooling , mounting pad.
ˆ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
‰ T_C measured with thermocouple incontact with top (Drain) of part.
Š R_θ is measured at T_J of approximately 90°C.
† Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
‡ Mounted to a PCB with a
thin gap filler and heat sink.
(still air)
ˆ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3