IRFR9310PBF Datasheet, PDF (2/10 Pages) International Rectifier – HEXFET POWER MOSFET

IRFR/U9310PbF
Electrical Characteristics @ T_J = 25°C (unless otherwise specified)
V_(BR)DSS
∆V(BR)DSS/∆TJ
R_DS(on)
V_GS(th)
g_fs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
I_DSS
Drain-to-Source Leakage Current
I_GSS
Q_g
Q_gs
Q_gd
t_d(on)
t_r
t_d(off)
t_f
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
L_D
Internal Drain Inductance
L_S
Internal Source Inductance
C_iss
Input Capacitance
C_oss
Output Capacitance
C_rss
Reverse Transfer Capacitance
Min.
-400
–––
–––
-2.0
0.91
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max.
––– –––
-0.41 –––
––– 7.0
––– -4.0
––– –––
––– -100
––– -500
––– 100
––– -100
––– 13
––– 3.2
––– 5.0
11 –––
10 –––
25 –––
24 –––
4.5 –––
7.5 –––
270 –––
50 –––
8.0 –––
Units
V
V/°C
Ω
V
S
µA
nA
nC
ns
nH
pF
Conditions
V_GS = 0V, I_D = -250µA
Reference to 25°C, I_D = -1mA
V_GS = -10V, I_D = -1.1A „
V_DS = V_GS, I_D = -250µA
V_DS = -50V, I_D = -1.1A
V_DS = -400V, V_GS = 0V
V_DS = -320V, V_GS = 0V, T_J = 125°C
V_GS = 20V
V_GS = -20V
I_D = -1.1A
V_DS = -320V
V_GS = -10V, See Fig. 6 and 13 „
V_DD = -200V
I_D = -1.1A
R_G = 21Ω
R_D = 180Ω, See Fig. 10 „
Between lead,
D
6mm (0.25in.)
from package
G
and center of die contact…
S
V_GS = 0V
V_DS = -25V
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
I_S
Continuous Source Current
(Body Diode)
I_SM
Pulsed Source Current
(Body Diode) 
V_SD
Diode Forward Voltage
t_rr
Reverse Recovery Time
Q_rr
Reverse RecoveryCharge
t_on
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– -1.9
A
MOSFET symbol
showing the
D
integral reverse
G
––– ––– -7.6
p-n junction diode.
S
––– ––– -4.0 V T_J = 25°C, I_S = -1.1A, V_GS = 0V „
––– 170 260 ns T_J = 25°C, I_F = -1.1A
––– 640 960 nC di/dt = 100A/µs „
Intrinsic turn-on time is negligible (turn-on is dominated by L_S+L_D)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
‚ Starting T_J = 25°C, L = 57mH
R_G = 25Ω, I_AS = -1.8 A. (See Figure 12)
ƒ I_SD ≤ -1.1A, di/dt ≤ 450A/µs, V_DD ≤ V_(BR)DSS,
T_J ≤ 150°C
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
…This is applied for I-PAK, L_S of D-PAK is measured between
lead and center of die contact
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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